New Products

PackagePrep CE Tin S process is for singulated QFN package side walls.

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Reference Gerber Viewer 2.1 supports drill files in NC or Excellon format. Fabrication data with drill files in NC format can now be viewed.

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Solderless vertical launch connectors are reportedly ideal for high-speed networking, high-speed computing and telecommunications applications.

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Speedstack v18.08 PCB stackup design software can export and import stack-up and impedance structure data using IPC-2581B XML file format.

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TO-20 non-inductive, thick-film heat sink resistor comes in TO-220 package.

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6892 series connectors feature 0.5mm-pitch flexible printed circuit (FPC) and flat flexible cable (FFC) with improved quality assurance checks.

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