Printed Circuit Design & Fab Online Magazine - New Products

New Products

PCB East 2007 Featured Product

MicroTCA (Telecommunications Computing Architecture) is a PICMG standard, open architecture specification using field-replaceable, hotswap capable, Advanced Mezzanine Cards. Simon Industries’ microTCA tabletop development chassis is well-suited for developing and debugging microTCA systems using full-height and half-height AMC modules. Utilizing the Molex Dual-Star backplane, the Simon chassis can facilitate hardware and software development, accelerate time to market and allow developers to evaluate various AMC cards, power supplies and MCH products. The Simon chassis features blind mating connectors to enable live replacement of the fan tray without powering down the chassis. The backplane features the Molex press-fit edge card connectors that are combined with precise launch geometry, minimizing reflections and enabling 10 Gbps over each differential pair. To minimize crosstalk, the design of the microTCA backplane employs spacing between pairs of at least 0.25 mm. Also, the backplane has a FRU ROM (Field Replaceable Unit Read Only Memory) that facilitates communication of all the important backplane characteristics to the MCH.

PCB East 2007 Featured Product

Beginning in November, SIPAD Systems will begin offering laser-cut stencils. SIPAD Systems has purchased a T8 SPS Laser from Tech Source International.

PCB East 2007 Featured Product

New from T-Tech is IsoPro 2.7—the best software in the industry for rapid prototyping with milling technology! Providing you with new capabilities including: record motion, auto alignment, customizable hot keys, automatic backup, revert to last saved file, e-mail and server compatibility! Contact T-Tech today, and improve your milling experience! T-Tech introduces Quick Vac Table, a vacuum table system designed to meet the demanding needs of the RF and microwave industry. Now create prototypes on flexible materials with greater precision. The Quick Vac Table holds material down uniformly providing consistent and accurate depth of cut. Existing systems are retrofittable!

PCB East 2007 Featured Product

This I/O Designer product is specifically for PADS®. The PADS I/O Designer product enables concurrent design by bridging the unique FPGA and PCB design flows, automating the various processes needed to implement today’s high pin-count, high-speed FPGAs on PCBs. The benefits: decreased design cycle time, improved performance, and lower product costs.

Continuous vertical Desmear electroless copper equipment is said to combine the process quality and production advantages associated with horizontal continuous platers. Said to have easier release of entrapped air and gas; uniform, high-volume delivery gained by the transport of panels past fluid delivery spargers. Advantages are said to include a high-reliability end product; improved 1st pass yield; the ability to process wide range of panel thicknesses without compromise on parameters; low CD strike/semi panel improves copper deposit properties. Process reportedly allows optimized de-smear on various substrates.

Process Automation International Ltd., www.palhk.com

Elpemer FP 207-1010 color-stable photoimagiable solder resist and Elpemer FP 207-1015 photoimagiable marking ink are screen-printable. Said to resist yellowing brought about by increased temperature stress during lead-free soldering.

Lackwerke Peters, www.peters.de