Magazine Articles

New design tools that incorporate strategic planning, routing guidance and design feedback.

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New analysis tools measure the performance of the power delivery system and consider both cost and electrical performance resulting in a functional and cost-efficient design.

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Asian control of cell phone and IC substrate production propels growth.

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Lead-free assembly requires a balance between copper, base material and design to assure reliability.

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Immersion silver and high temperature OSPs meet the manufacturer’s goals of low cost and ease of use, and the assembler’s need for high first-pass yields and improved long term reliability.

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OEM designers and their EMS partners should evaluate SerDes device characteristics and match them to known PCB design constraints to improve overall performance.

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