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Design News
- Zarrow to Host Next UPMG 'PCB Chat'
- ACD Sets Annual Sales Record
- Sigrity Opens 4 More Offices
- Bay Area Circuits Offers Array Layout Calculator
- Element14 to Distribute Sunstone’s PCBs
- Altium Adds STM Power Components to Parts Library
- Zuken Promotes Chidester, Expands Marketing Team
- UP Media Announces 'PCB Chat'
- IPC Comments on Proposed State Dept. Changes to Export Control
- Q4 Sales Offer No Surprises for Mentor
Market News
- WTO Upholds Ruling Against China Over Raw Material Exports
- iSuppli: Sluggish Semi Sales in Store
- US Manufacturing Picture Continues to Improve
- Manufacturing Numbers Looking Better Worldwide
- December North American PCB Shipments Down 5% YoY
- US Durable Orders Up Again in December
- SIA Backs Obama's Commitment to Tech
- December N. American Semi Gear Orders Down 27% YoY
- Research Firms Say Global Q4 PC Shipments Down Slightly
- Report: Chip Package Substrate Demand to Grow 5% This Year
Fab News
- PCB Assembly Express Offers Real-Time Online Quoting
- Saturn’s Sales Soared in 2011
- Isola’s Revenues Down 9.4%
- 3M's Electronics Unit Sees Softer Demand
- European Circuits to Begin Expansion
- AT&S Flat Sequentially Despite Mobility Gains
- Analysts Press Flextronics on Components Unit
- Flextronics Q3 Sales Down 4% to $7.5B
- Cicor to Shutter Photochemie PCB Plant
- Meiko to Reopen Wuhan Plant
Products
Rainbow Technology Debuts Rainbow Process Imaging Systems
Rainbow Process incorporates printed circuit board coating, imaging and developing in a single compact, automated unit.
Rainbow Process incorporates printed circuit board coating, imaging and developing in a single compact, automated unit.
Features
Specifying QFN Stencils and Solder Layers
When it comes to paste coverage, less is more. I write a lot about things that go wrong with various layouts. Hopefully by doing that, I can help some readers avoid common pitfalls. But I should probably write about more good things to balance them out.Here’s a decent example. Figure 1 shows a good way to specify the solder paste layer for QFN parts. Notice that the center thermal area is segmented to give about 50% paste coverage. This...
When it comes to paste coverage, less is more. I write a lot about things that go wrong with various layouts. Hopefully by doing that, I can help some readers avoid common pitfalls. But I should probably write about more good things to balance them out.Here’s a decent example. Figure 1 shows a good way to specify the solder paste layer for QFN parts. Notice that the center thermal area is segmented to give about 50% paste coverage. This...
- Optimizing PCB Design for Tablet PCs
- Copperless Flex Circuits
- Signal Integrity and PCB Physical Parameters
- In Case You Missed It
- No Counterfeits, No Excuses
- Invest or Cut Back?
- Why Quick is Not Always Better
- Benchmarking and Qualifying PCB Fabricators for Semiconductor Device Test Boards
- ‘An End-to-End Solution for Assembled HDI Rigid-Flex’
- In Case You Missed It
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