PEACHTREE CITY, GA – July 1, 2026 – The Printed Circuit Engineering Association (PCEA) this fall will feature a dedicated program of electronics assembly tracks at PCB West, including 10 presentations led by leading practitioners in solder paste, placement, reflow, stencil design and cleaning. The assembly program takes place September 29-30, 2026, at the Santa Clara (CA) Convention Center.

Spanning introductory through advanced material, the tracks give assemblers, process engineers and manufacturing professionals practical, noncommercial training on the core processes that determine circuit assembly yield and reliability. Registration is open at pcbwest.com.

The sessions kick off on September 29 with A Data-Driven Solder Paste Qualification Process, a 3.5-hour workshop from Chrys Shea of Shea Engineering. There are numerous avenues by which assemblers can enhance reliability, reduce costs and increase the yields of their products through the qualification of a new solder paste. The problem they face is how to do it. Solder pastes have many properties to consider and test for, and there are many pastes to choose from. It can appear to be a daunting task, and a potentially risky one if something gets overlooked in the process. The solder paste selection scorecard simplifies the process.

Nine sessions covering basic and advanced electronics assembly will be held September 30, including:

Register for the assembly program now at pcbwest.com. Conference registrants who sign up by August 21 can take advantage of the Early Bird Special discounts for the conference.

PCB West will be held September 29 to October 2 at the Santa Clara Convention Center. An exhibition featuring more than 100 leading suppliers to the electronics design and manufacturing industry will be held September 30.

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