Master Bond introduced EP64, a two-component epoxy system designed for bonding, sealing and coating applications in electronics and aerospace environments. Meets NASA low outgassing requirements per ASTM E595 and is engineered for vacuum-compatible applications. Features a glass transition temperature of 210–215°C, enabling stable performance in elevated temperature conditions. Offers tensile strength of 3,000–5,000psi and a tensile modulus of 540,000–680,000psi, along with Shore D hardness of 80–90. Epoxy maintains electrical insulation properties and resists exposure to acids, bases, and solvents.

Operates across a temperature range of -60°F to +450°F (-51°C to +232°C). Working life of 12–24hr for a 100g batch at room temperature and exhibits moderate viscosity with flow characteristics suitable for coating and bonding applications. The recommended cure profile includes 80–90°C for 4–6hr, followed by a post cure at 120–130°C for 2–4hr to achieve full thermal performance. Bonds to metals, plastics, rubbers, ceramics, and composites. Available in multiple packaging formats, including pint and gallon kits, as well as premixed and frozen syringe options.

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