Magazine Articles

High pin count BGAs capture significant improvements in thermal and electrical performance.

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This year it was a one-stop show, from PCB design, to fabrication, through testing and into assembly.

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Nanomaterials provide the basis for flexible embedded components that meet the demands of new low-cost, large-area, flexible and lightweight devices.

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Roughness on the large conductor surfaces of a PCB can increase the interconnect loss as much as 50%.

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Collaborative tools bring chip, package and PCB designer together to improve the system design process.

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