Canton, MA — April 2026 — Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026), taking place April 28–30, 2026, at the Renaissance Los Angeles Airport Hotel.

Recognized as the premier event focused on the design, reliability, and application of electronic components for aerospace, defense, and space systems, CMSE 2026 brings together leading engineers, technologists, and innovators to address the industry’s most pressing technical challenges.

As part of the conference’s Day 1 technical program, Chandra Gupta, Director of Business Development at Remtec, will present “Innovative Ceramic Sub-Mounts and Heat Spreaders.” His session will explore advanced thermal management strategies critical to improving the reliability and performance of high-power electronic systems.

High-power semiconductor devices—such as amplifiers and DC-DC converters—face significant thermal challenges that can impact performance and long-term reliability. Dr. Gupta’s presentation will address how advanced ceramic materials and engineered sub-mount designs can dramatically improve heat dissipation, reduce thermal resistance, and extend mean time before failure (MTBF) in mission-critical applications.

“CMSE is one of the most important technical gatherings in our industry because it brings together the people who are solving the toughest reliability challenges in aerospace, defense, and space electronics,” said Mr. Buyea. “For Remtec, it’s an opportunity not just to showcase our technology, but to contribute to the collective advancement of high-performance, high-reliability electronic systems. The conversations that happen here—especially around thermal management and materials innovation—are critical to the future of our industry and the systems that depend on it.”

CMSE 2026 is designed to foster deep technical engagement through high-quality presentations, keynotes, and interactive discussions. The event also plays a vital role in educating the next generation of engineers, ensuring the continued advancement of technologies that support national defense and space exploration.
Remtec’s participation underscores its commitment to solving complex thermal and reliability challenges through advanced materials and integrated manufacturing solutions.

About Remtec

Remtec is a leading provider of advanced ceramic substrates and microelectronic assembly solutions, specializing in high-performance applications where thermal management, reliability, and signal integrity are critical. Leveraging proprietary technologies such as plated copper thick film (PCTF®), Remtec delivers solutions using materials like alumina and aluminum nitride to support demanding environments across aerospace, defense, telecommunications, and power electronics.

From substrate design to fully integrated assembly—including die attach, wire bonding, and system-level integration—Remtec provides end-to-end solutions that help customers improve performance, reduce risk, and accelerate time to market. With a strong focus on engineering collaboration and innovation, Remtec continues to push the boundaries of what’s possible in high-reliability electronics.