Ultralam 3850HT liquid crystal polymer laminates are for simplified and improved construction of multilayer circuit boards at higher temperatures. Have a melt temperature of +330°C, are adhesiveless and use LCP as the dielectric film. For single-layer and multilayer circuit constructions. For high-speed and high-frequency circuit applications such as in mobile and Internet communications devices and automotive radar systems. Survive multiple solder reflow procedures and increase MLB board processing temperature window. Design dielectric constant (Dk) is 3.14 at 10GHz and +23°C. Dissipation factor (Df) is typically 0.0020 at 10GHz and +23°C. Coefficient of thermal expansion (CTE) (from +30° to +150°C) is typically 18 ppm/°C in x and y dimensions and 200 ppm/°C through z dimension for dimensional stability, predictable MLB scaling, and MLB registration. Thermal conductivity of 0.2 W/m/°K and thermal coefficient of dielectric constant of +24 ppm/°C from -50° to +150°C. Come in panels of double copper-clad laminates of 18 x 12 " (457 x 305mm) and 18 x 24" (457 x 610mm) with ¼-oz. (9-μm) and ½-oz. (18-μm) low-profile electrodeposited (ED) copper. Panels with rolled copper and in custom sizes available upon request.   

Rogers Corp. www.rogerscorp.com.

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