Talon 3 electroless palladium allows plating directly onto copper. Paves the way for electroless palladium/ immersion gold (EPIG).

Developed for applications that cannot tolerate nickel: medical sensors; flexible circuits; electronic products that cannot use nickel due to problems related to magnetics and frequency, and high-frequency circuitry (particularly aerospace). Deposits an electroless/autocatalytic palladium that is solderable and gold wire bondable. Bath has low palladium metal content. Rate of deposition and quality of deposit are reportedly consistent throughout the product’s bath life. EPIG finish solders after eight hours of steam aging.  

Uyemura
www.uyemura.com

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