CAVE CREEK, AZ – The High Density Packaging (HDP) User Group is starting a new project on PTH lifetime predictors for temperature cycling.

This project aims to establish an accelerated equation to predict PTH lifetime. It can be used to give a more accurate prediction of the product warranty period based on the product’s operating environment, says the group. It can also be used to find PTH critical design factors to fine-tune the PTH design at the early printed circuit board design stage, bringing improvement to product lifespan.

“Plated Through Hole (PTH) lifetime Predictor for Temperature Cycling (TC)” will focus on PCBs used in telecommunication equipment, computers and servers.

FEM will be used to simulate different PTH specifications and operating environments to compute the time to failure of the PTH. Thermal cycle tests will be performed to compare the physical time to failure with the calculated one. This process will be repeated to achieve the optimum result and establish the accelerated equation to predict PTH lifetime for TC.

“Right now the conventional approach is to do accelerated temperature cycling to predict the PTH life,” said Jack Tan, project facilitator at HDP. “BGA/LGA solder joint lifetime, on the other hand, can be predicted using the modified Coffin-Manson equation. Using such accelerated equation with parameters saves time and cost in predicting the lifetime of interconnects.”

If you are interested in participating in this project, contact Jack Tan at This email address is being protected from spambots. You need JavaScript enabled to view it..

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