HAVERHILL, MA – DKN Research developed a new copper metalizing process using transparent polyimide films. The new copper laminate will provide manufacturing capabilities using transparent flexible PCBs for traditional manufacturers. It is made from a thin transparent polyimide file plated with a copper layer on both sides.  

During the R&D process, DKN Research established an electroless and electro-plating process of nickel, copper and gold on the transparent polyimide films, providing thin copper laminates available for the standard photolithography-etching process of high-density flexible circuit boards.

The new copper laminate could be valuable for traditional flexible circuit board manufacturers because it doesn’t need additional equipment or chemicals to build transparent flexible PCBs. Transparency can be more than 85%, says the firm.

The standard construction of the laminate uses double- sided 3µm thick copper layers on a 25µm thick transparent polyimide film. The copper thickness can be thinner at 0.2µm, and wider thickness ranges will be available.

Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: PCBWEST.COM

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