| Rogers to Showcase Materials Solutions at Designcon 2010 | | Print | |
| Written by Chelsey Drysdale | |||
| Monday, 11 January 2010 17:09 | |||
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SANTA CLARA, CA – Rogers Corp. will feature advanced materials for electronics design at DesignCon here next month. Rogers Advanced Circuit Materials Division will show Theta printed circuit materials, Ultralam 3000 laminates, RO2808 laminates, and RO4000 LoPro circuit board materials. Headquartered in Rogers, CT, the firm develops and manufactures high-performance, specialty-material-based products for a variety of applications.
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Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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